Cu-phos Bawm

Microcrystalline phosphorus magri n-gang ni gaw wan n-gun hte n-gun dat ai magri anode arung arai langai mi re. Madung n-gun gaw magri rai nna, magri a n-gun gaw 99.94% jan rai nna, phosphorus gaw 250 kaw nna 650 ppm du hkra rai nga ai. Ndai arung arai ni hpe madung hku nna PCB galaw ai, mawn sumli ai hte ntsa lam hpe gram lajang ai, nhtoi htoi ai bungli zawn re ai electroplating copper galaw ai bungli ni hta jai lang ai. Microcrystalline phosphorus magri mang ball ni gaw, lahkam mi hta sha, shingnip ni hpe hpaw shabawn na matu, hpaga lam- woi awn ai, hkum tsup ai hku katsi ai bawnu hpe hkap la ai. Microcrystallization tsi ladat hku nna, 50 um hta n-pu na n-gun rawng ai n-gun n rawng ai phosphorus magri ball ni hpe shapraw lu ai. Anode film (phosphorus copper film) gaw grau kaja ai bungli galaw ai lam hpe madun dan nna, jai lang ai lam hpe kaja wa shatsaw ya lu ai hte unit copper jai lang ai lam hpe shayawm ya lu ai. Microcrystalline phosphorus magri ball ni gaw magri yawng lang ai hta 3% jan shayawm lu ai hpe chyam dinglik ai lam ni hta sakse madun da ai.

Microcrystalline phosphorus magri n-gang ni gaw wan n-gun hte n-gun dat ai magri anode arung arai langai mi re. Ndai tsi hpe madung hku nna PCB galaw ai, mawn sumli ai, LED arung arai ni, hte hardware daw ni hte ntsa lam hpe gram lajang ai zawn re ai electroplated copper galaw ai bungli ni hta jai lang ai. Microcrystallization tsi ladat hku nna, um hta n law ai nli tum n-gun rawng ai, n-gun n rawng ai phosphorus magri ball ni hpe shapraw lu ai. Anode film a bungli galaw ai lam gaw grau kaja ai, application galaw ai lam hpe kaja wa shatsaw ya lu ai hte unit copper jai lang ai lam hpe mung shayawm ya lu ai.